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制程能力及检测参数 Process?capability?and?checking?parameters |
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| ITEM | Technical capabilities | |||||||
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层次 Layers |
2-32layers | |||||||
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最大尺寸 Max.Board Size |
1200mm*610mm | |||||||
| 79"*24" | ||||||||
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板厚 Finished Board Thickness |
0.25mm--10.0mm | |||||||
| 0.01"--0.4" | ||||||||
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铜厚 Finished?Copper?Thickness |
17um-420um | |||||||
| 0.5OZ--12OZ | ||||||||
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最小线宽/线距 Min.Trace Width/Space |
0.075mm/0.065mm | |||||||
| 0.003"/0.0026" | ||||||||
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最小孔径 Min.Hole Size |
0.1mm | |||||||
| 0.006" | ||||||||
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PTH孔孔径差 Hole Dim. Tolerance(PTH) |
±0.05mm | |||||||
| ±0.002" | ||||||||
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NPTH孔孔径差 Hole Dim.Tolerance(NPTH) |
±0.05mm | |||||||
| ±0.002" | ||||||||
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孔位公差 Drill Location Tolerance |
±0.05mm | |||||||
| ±0.002" | ||||||||
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V-CUT角度 V-Score Degrees |
20-90度 | |||||||
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最小V-CUT板厚 Min.V-Score PCB Thickness |
0.25mm | |||||||
| 0.01" | ||||||||
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外型公差 CNC Routing Tolerance |
±0.1mm | |||||||
| ±0.004" | ||||||||
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最小盲/埋孔 Min.Blind/Buried Via |
0.1mm | |||||||
| 0.0039" | ||||||||
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塞孔 Plug Hole Size |
0.2mm--0.5mm | |||||||
| 0.008"--0.02" | ||||||||
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最小BGA Min.BGA PAD |
0.2mm | |||||||
| 0.008" | ||||||||
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材质 Materials |
FR4板（指定品牌物料：如建滔、生益、联茂、南亚、台光台耀等)、高频板、铁氟龙板、陶瓷板、罗杰斯板等等 |
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FR4 (designated brand materials: such as KB, Shengyi, ITEQ, NANYA, EMC,CENS and so on), high frequency board, Teflon board, ceramic board, Rogers board and so on |
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表面处理 Surface Finish |
无铅喷锡，沉金，沉银，沉锡，OSP,电厚金，沉金+OSP,喷锡+金手指，镍钯金， |
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LF-HASL,ENIG,ImAg,ImSn,OSP,Gold plating,ENIG+OSP,HASL+G/F， |
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翘曲度 Warp&Twist |
≤0.75% | |||||||
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通断测试 Electrical Testing |
50--300V | |||||||
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可焊性试验 Solderability Testing |
245±5℃,3sec Wetting area least95% | |||||||
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热冲击试验 Thermal Cycling Testing |
288±5℃,10sec,3cycles | |||||||
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离子污染测试 Ionic Contamination Testing |
Pb,Hg,Cd,Cr(VI),PBB,PBDE六项均小等于1000ppm |
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Pb,Hg,Cd,Cr(VI),PBB,PBDE?six items are less than 1000ppm |
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附着力测试 Soldmask Adhesion?Testing |
260℃+/-5,10S，3times | |||||||
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特殊工艺 Special Technology |
半孔、高Tg板、混压板、无卤素板、超薄超厚板、邦定、 阻抗、蓝胶、碳油、电厚金、镍钯金、金手指、盲锣、埋盲孔、沉头孔、树脂塞孔等. |
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